JPH04384B2 - - Google Patents

Info

Publication number
JPH04384B2
JPH04384B2 JP58084525A JP8452583A JPH04384B2 JP H04384 B2 JPH04384 B2 JP H04384B2 JP 58084525 A JP58084525 A JP 58084525A JP 8452583 A JP8452583 A JP 8452583A JP H04384 B2 JPH04384 B2 JP H04384B2
Authority
JP
Japan
Prior art keywords
bonding
pellet
substrate
head
positioning table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58084525A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59210647A (ja
Inventor
Kyoshi Mayahara
Yoshio Yamaguchi
Takeichi Yoshida
Yutaka Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8452583A priority Critical patent/JPS59210647A/ja
Publication of JPS59210647A publication Critical patent/JPS59210647A/ja
Publication of JPH04384B2 publication Critical patent/JPH04384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP8452583A 1983-05-14 1983-05-14 ペレツトボンデイング装置 Granted JPS59210647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8452583A JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8452583A JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59210647A JPS59210647A (ja) 1984-11-29
JPH04384B2 true JPH04384B2 (en]) 1992-01-07

Family

ID=13833051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8452583A Granted JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59210647A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0630363B2 (ja) * 1983-10-12 1994-04-20 ソニー株式会社 チツプ部品の装着装置
JPS61186235U (en]) * 1985-05-10 1986-11-20

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042612B2 (ja) * 1978-01-12 1985-09-24 株式会社東芝 半導体装置部品装着機
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

Also Published As

Publication number Publication date
JPS59210647A (ja) 1984-11-29

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